With the support of advanced equipment clusters, profound process accumulation and cross-disciplinary technology integration capabilities, we comprehensively cover the core links of micro-nano processing, and can deliver reliable and precise products and efficient collaborative services. At present, we have achievedmaturing coverage of 2/4/6-inch wafer processing, and some equipment and processes support8-inch wafer的需求, to solve the industry's composite challenges with technical strength.

1. Core process matrix: Precise control of every step of the processing details

Focusing on the three core aspects of "precision, compatibility, and efficiency," we have built a process system that covers the entire flow of processes, including coating, photolithography, and bonding. Key parameters have reached the leading level in the industry, meeting the manufacturing needs of micro-nano structures in different scenarios.

1. Deposition process: full-field deposition, nano-level film system architecture

For the demand of single-layer film and complex stack, through multi-material compatible system and cross-process integration (ALD/PVD/plasma enhanced CVD), the film system with nano-level precision is realized, which synchronously guarantees yield and cost efficiency, and supports the full scenario from scientific research customization to mass production.

Additional Support:Open target material self-adaptive channel to accelerate customer's cutting-edge material verification process.

2. Photolithography process: ultra-fine pattern transfer, versatile for multiple sizes

Covering the full precision range from electronic beam lithography to DUV photolithography, it can achieve pattern transfer at the 10nm-1μm level, meeting the fineness requirements of different devices, and the substrate size is flexibly adapted to small samples to large-size wafers.

3. Bonding process: low-temperature compatible, thickness without deviation

Supports anodizing bonding, eutectic bonding, Si-Si/Al₂O₃-Al₂O₃ bonding at room temperature, with bonding temperatures coveringroom temperature to 400℃, release materials with weathering limitations, bonding thickness without deviation, compatible with2/4/6/8-inch wafers, ensuring the reliability of device packaging.

4. Other core processes

Nanoprinting

Customizable nickel master plate/polymer master plate, adapted to substrates such as sapphire, quartz, silicon, etc., to achieve efficient replication of micro-nano structures.

Cutting process

Covering laser hidden cutting, blade wheel cutting, infrared cutting, cutting accuracy ≤ 20μm, support ≤ 8 inches substrate, ensuring device forming consistency.

Ion beam polishing

For silicon/SOI/quartz substrates (≤4 inches), polishing accuracy up to 0.3nm@15×15μm, achieving ultra-smooth surface processing.

Single-point diamond turning and injection molding

Specializing in the manufacture of complex free-form optical components, with no shrinkage in the surface profile and superior accuracy, meeting the geometric shape requirements of high-end optical elements.

2. Infrared detection service: High-precision material analysis solution.

Fourier infrared spectroscopy detection system

We are equipped with advanced Fourier infrared spectrometer, providing high-precision infrared spectroscopy analysis services for a variety of materials, supporting the full process of quality control and material property research from R&D to production, and widely used in the testing needs of micro-nano devices, optical films, composite materials and other fields.

Service advantages

• High-resolution detection capability, capturing subtle structural features of materials

• Broadband coverage, meeting the inspection needs of a variety of material systems

• Professional data analysis team, providing customized detection reports and interpretation.

• Flexible testing solutions, supporting scientific research sample and mass production batch testing

Three, Special Process Solutions: Targeted solutions to industry pain points.

Based on years of industry experience, we have developed dedicated processes for specific application scenarios, providing customers with "tailor-made" technical solutions:

• Low temperature ALD packaging process: Excellent performance in depth ratio, WVTR ≤ 10⁻⁵@ double 85 test, meets the demand for high reliability packaging.

• Spectral 3D Array: Channel number ≥ 30, Z-axis accuracy ≤ 1nm, XY-axis resolution ≤ 5μm, Adapted for spectral detection devices.

• Non-spherical micro-lens array processing: shrinkage rate ≤ 1%, surface roughness Ra ≤ 5nm, surface accuracy RMS ≤ 0.1μm, PV ≤ 1μm, ensuring stable optical performance.

• DUV processing of superstructures and EBL Si wafers MS DOE: Supporting the manufacturing of ultra-fine micro纳structures, providing technical support for cutting-edge device research and development.

• Mass production of low-cost wafers coating: Balancing mass production efficiency and cost to meet the industry's large-scale application needs.

IV. Cross-border Synergy: Creating Composite Value through Technological Coupling

With the interdisciplinary accumulation of semiconductor micro-nano processing, optics, MEMS, and laser technology, we break the limitations of a single process and build a synergistic advantage in device architecture design, process chain integration, and system-level optimization.

From "single processing" to "integrated solutions", we help customers overcome complex technical issues with cross-border insights, continuously creating added value beyond traditional processing, and becoming your reliable partner on the road of innovation.